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PRESS
RELEASE
Contact: David Burleigh, Quatech, Inc. 5675 Hudson Industrial Parkway Hudson, OH 44236-5012 Phone: 330-655-9000 Fax: 330-655-9010 Email: david.burleigh@quatech.com FOR RELEASE May 8, 2005 Quatech Launches 802.11b/g Wireless Networking Products for OEMs Quatech Airborne™ and AirborneDirect™ embedded and external products Hudson, OH, May 8, 2006 – QuaTech Inc., a wholly-owned subsidiary of DPAC Technologies Corp. (OTCBB: DPAC) and a leader in high performance device networking solutions, announced the launch of the next generation of its entire family of Airborne™ 802.11 embedded wireless modules and AirborneDirect™ 802.11 external wireless networking products for OEM machine-to-machine (M2M) applications. The new line of products features the higher connection rates of the 802.11g standards, plug-n-play compatibility with Quatech’s existing 802.11b product line, advanced security features and extended environmental specifications. They are also fully compliant with RoHS standards. “This new family of 802.11b/g products extends our leadership position in 802.11 wireless embedded networking that DPAC began with the industry’s first module in 2003,” said Steve Runkel, president and CEO of Quatech. “We’re excited about the opportunity to bring the additional benefits of the 802.11g standard to our customers and partners. We see a demand for the performance and security features enabled by these new products, and we believe our customers will continue to experience the industry’s best combination of cost, ease-of-deployment, performance and throughput.” Over the past three years, the Airborne and AirborneDirect products have been integrated into a wide variety of M2M communications applications, from transportation and industrial automation to medical diagnostics and warehouse/logistics. The product family is designed to be quickly and easily integrated by OEMs to build secure 802.11 wireless capabilities into virtually any M2M device. The product line offers features such as extended environmental specifications (operating temperature range of -40ºC to +85ºC), advanced Security protocols (WEP—64 & 128 bit, WPA, 802.1x-LEAP, integrated AES/CCMP), RoHS compliance, and Regulatory pre-certifications across the globe (like U.S. Federal Communications Commission certification) allowing OEMs to leverage Quatech’s license grant and bypass most or all regulatory testing. The Quatech Airborne and AirborneDirect products that feature the 802.11b/g functionality are:
Quatech Airborne and AirborneDirect 802.11b/g product shipments will begin in June 2006. For more information, please visit: http://www.quatech.com/products/embedded.php. About Quatech and DPAC Technologies DPAC Technologies (OTCBB: DPAC) provides embedded wireless networking products for machine-to-machine communication applications. DPAC's Airborne™ and AirborneDirect™ wireless products are used by major OEMs in the transportation, instrumentation and industrial control, homeland security, medical diagnostics and logistics markets to provide mobile short range data collection and control. Information concerning the combined company under parent company DPAC Technologies Corp. is filed with the SEC and is available on the SEC website, www.sec.gov. DPAC Technologies Corp. is based in Hudson, OH. www.dpactech.com. Forward-Looking Statements Additional Information: DPAC and QUATECH strongly urge their respective shareholders to read the relevant documents related to this transaction as and when filed by DPAC with the SEC, because they shall contain important information all the shareholders should consider. All DPAC's SEC filings are made available free of charge at the SEC website (www.sec.gov). Such documents, when filed, also are made available free of charge by DPAC. DPAC has filed a Form 8-K containing the current agreement between DPAC and QUATECH. After DPAC and QUATECH, INC. sign a definitive agreement, DPAC shall file further statements and reports with the Securities and Exchange Commission. This news release is neither a solicitation of any proxies nor an offer of any securities of any kind whatsoever. No securities mentioned herein have been registered or authorized or approved by any federal or state securities regulator or commission. ###Download a .pdf version of this release
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